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- Vekooler Technology to Showcase Comprehensive AI HPC Liquid Cooling Solutions at COMPUTEX 2026
Vekooler Technology to Showcase Comprehensive AI HPC Liquid Cooling Solutions at COMPUTEX 2026
May 07,2026
Vekooler Technology is excited to announce its participation in COMPUTEX 2026, where we will present our latest AI HPC liquid cooling components and advanced thermal management solutions.
📅 Date: June 2 – June 5, 2026
📍 Venue: Taipei World Trade Center Hall 1
🏢 Booth No.: A1107a
As global AI computing demand continues to surge, efficient thermal management has become a critical factor for AI servers, HPC infrastructure, and modern data centers. With years of expertise in thermal engineering and liquid cooling technologies, Vekooler Technology is committed to delivering high-performance, high-reliability cooling solutions for next-generation computing platforms.
Featured products at the exhibition include:
Our engineering team will be available on-site to provide technical consultations and discuss future AI and HPC cooling trends.
We sincerely welcome partners and industry professionals to visit our booth and explore future collaboration opportunities.
📅 Date: June 2 – June 5, 2026
📍 Venue: Taipei World Trade Center Hall 1
🏢 Booth No.: A1107a
As global AI computing demand continues to surge, efficient thermal management has become a critical factor for AI servers, HPC infrastructure, and modern data centers. With years of expertise in thermal engineering and liquid cooling technologies, Vekooler Technology is committed to delivering high-performance, high-reliability cooling solutions for next-generation computing platforms.
Featured products at the exhibition include:
- Metallic Cabinet – High-strength liquid cooling cabinet solutions designed for AI and HPC servers.
- Rack Manifold – Precision-engineered manifold systems for optimized coolant distribution.
- Liquid Cold Plate – High-efficiency cold plates utilizing advanced technologies including FSW and diffusion bonding.
- Heatpipe & Liquid Pipe – High-performance thermal transfer and liquid transportation solutions.
- Liquid Cooling Accessories – Quick connectors, anti-leak fittings, and integrated liquid cooling components.
Our engineering team will be available on-site to provide technical consultations and discuss future AI and HPC cooling trends.
We sincerely welcome partners and industry professionals to visit our booth and explore future collaboration opportunities.