Physical Vapor Deposition (PVD) Coating

Physical Vapor Deposition (PVD) Coating
PVD technology generates an arc discharge with high current and low voltage in a high vacuum environment, causing it to impact the metal target, which triggers cathodic arc light and plasma flow. A negative bias power supply is applied to the substrate to direct the positively charged ions from the dissociation to the substrate, resulting in thin-film deposition.

Advantages:

• Competitive cost (easily automated in-line arrangement)

• Thickness precision (±0.1um)

• Better coverage coating capability

PVD Chamber-type Equipment